News from Semiconductor International

Business - Semiconductor International

· SIA Forecast: 2009 Down Almost 6%

· Industry Downturn No. 11 Won’t Be as Bad as No. 10

· KLA-Tencor Announces Job Cuts

· MEMC Lowers Q4 Guidance Numbers

· Everspin Takes MRAM Up a Notch

· Applied Materials Sees Sharp Order Reductions, Plans Layoff of 1800 Workers

· IBM Offers 45 nm SOI Foundry Solution

· China’s Chip Industry Facing Challenges

· IC Industry Entering ‘Capitulation Mode’

· IMEC Calls for True European Collaboration

Clean Processing - Semiconductor International

· FSI Enters Single-Wafer Clean Market

· Measuring Material, Dopant Loss From Post-Implant Wafer Cleans

· Environmental Regulations Growing More Complex

· IMEC Views 3-D Stacking as System Design

· Treating Copper CMP Wastewater

· How Pump-Induced Particles Affect Low-k CMP Defectivity

· Shin-Etsu Polymer Develops Lightweight Resin Frame for Thin Wafers

· Increasing Demands Require New Look at Wafer Cleans

· Resist Removal Walks a Tightrope

· Ulvac Intros High-Throughput Asher

Lithography - Semiconductor International

· FSI Receives Repeat Polaris Order From GaAs Foundry

· Cymer Hitting Its EUV LPP Source Goals

· Advancements in EUV Optics Technology

· IMEC Calls EUV Performance ‘Impressive’

· ASML Presents Faster ArF Scanner, Says EUV on Track for 2010

· Kovio Demonstrates RFID Tags Using Printed Electronics

· Mapper to Ship E-Beam Lithography System to TSMC

· Mapper Lithography Names Hegarty as CEO

· Photomask Printability, Standards and Cleaning Remain Concerns

· De Geus Highlights Photomask Simulation Challenge

Leading Edge - Semiconductor International

· 3D IC at the WLP Conference

· 3D Global Meeting next week in San Francisco

· TSMC Roadmap, DRAM Timing and Sematech Highlights

· Memory market headed South ...Will SSD's lead the recovery?

· Opening the Kimono, Ziptronix gives details on DBI Process

· 3D IC Questions and Answers with the EMC-3D Consortium

· ....on Mechanical Bulls, Rollercoasters and CIS with TSV

· It Depends on What the Meaning of Is, Is

· Upcoming 3D Integration events & Issues with the ITRS 3D Roadmaps

· Keepin' it Cool in the Dog Days of Summer

Wafer Processing - Semiconductor International

· TSMC Begins Production of 40 nm Designs

· IBM Offers 45 nm SOI Foundry Solution

· Resistivity Reduction Enables Tungsten Scaling

· Measuring Material, Dopant Loss From Post-Implant Wafer Cleans

· SMIC, UMC cut capexs

· Logic Technologies Face Off at IEDM

· ISMI Outlines 450 mm Wafer, NGF Roadmaps

· IMEC Calls EUV Performance ‘Impressive’

· Despite Losses, Toshiba to Continue Aggressive Investments

· IMEC Has Air Gaps in Post-22 nm Roadmap for Interconnects

Other Headlines

· Compound Semiconductor

· Controlled Environments

· Electronics Weekly

· Power Electronics

·Semiconductor International

· Semiconductor Online

· Solid State Technology

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