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Material Safety Data Sheets

IC fabrication utilizes many aggressive chemicals. It is the responsibility of the workers in the lab to have an understanding of what these chemicals can do and how to safely handle them.

Chemicals Used in ECE444

• H₂SO₄ - sulfuric acid
• HCl - hydrochloric acid
• 6:1 BOE - buffered oxide etch
• HNO₃ - nitric acid
• HF - hydrofluoric acid
• H₃PO₄ - ortho-phosphoric acid
• NH₄OH - ammonium hydroxide
• NH₄F - ammonium fluoride
• H₂O₂ - hydrogen peroxide
• HMDS - hexamethyldisilazane
• (CH₃)₂CO - Acetone
• IPA - isopropyl alcohol
• Shipley 1813 photoresist
• Shipley MF-319 Developer
• Saint Gobain BN975 PDS - boron nitride solid diffusion source
• Saint Gobain PH1025 PDS - phosphorus solid diffusion source

DRS MSDSs

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Lab Safety

· Chemical Hygiene Plan

·MSDSs

· Evacuation Routes

· Fire Alarms

· Hydrogen Alarms

· Injuries

· Personal Protective Equipment

· Power Outage

· Safety Handout

In case of emergency, always call 9-911 and give the following information:

·Your name

·Location:
IC Fabrication Laboratory
Room 50Q
Basement of Everitt Lab
1406 W. Green St.

·Specific information about the emergency

Answers provided by this service may not be relevant to the materials presented in this website.

Department of Electrical and Computer Engineering
College of Engineering
University of Illinois Urbana-Champaign

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