UIUC ECE Title Bar ece444
Theory and Fabrication of Integrated Circuits University of Illinois at Urbana-Champaign logo

HOME · LECTURE · LAB · GT · CALCULATORS · Text Only

LAB HOME · SAFETY · CLASS TIMES · DEVICES · EQUIPMENT · MANUALS

LDS Thermal Evaporator

Description Operation Oops...

The LDS 18-7211 Thermal Evaporator System was designed and built in the Spring 2003 semester to supplement the Cooke 301, which can only do a limited number of wafers with unpredictable metal thickness results. The 7211 was custom-built specifically for the ECE444 laboratory by Leon Schneider and Dane Sievers .

Cooke LDS
Bell Jar Diameter 12" 18" 
Bell Jar Material glass stainless steel
Number of filaments 2 2
Filament type W (tungsten) coil W (tungsten) boat
Filament PS variac Concordia
Number of wafers/run 8 x 2"/2 x 4" 9 x 4"
Hi Vac Valve 2" butterfly 160mm gate
Roughing pump Sargent-Welch Duo-Seal 1402 Leybold D65BCS
Roughing pump speed 5.6 cfm 53.7 cfm
Hi vac pump 2" diffusion pump Leybold TMP1000C
Hi vac pump speed 325 l/s ~900 l/s
Low vac gage 2 TCs 2 Convectron
Hi vac gage cold cathode inverted magnetron cold cathode
Ultimate pressure 1 x 10^-5 Torr 5 x 10^-8 Torr

Process Equipment

· Gaertner Ellipsometer

· Evaporator (CVE)

· Evaporator (LDS)

· Filmetrics FT-20

· Prometrix FT650

· Four Point Probe (LDS)

· Four Point Probe (Veeco)

· Furnace

· Plasma Asher

· Spin-Rinse-Dryer

· Stepper (Nikon)

· Stepper (Ultratech)

· Probe Stations

Answers provided by this service may not be relevant to the materials presented in this website.

Department of Electrical and Computer Engineering
College of Engineering
University of Illinois Urbana-Champaign

Contact ece444
Copyright © 2007, 2008, 2009, 2010, 2011, 2012 The Board of Trustees at the University of Illinois. All rights reserved.

archives: ©1999   ©2000   ©2004   ©2005   ©2006